The innovative R*evolution® Remote Plasma Source combines field-proven, low-field toroidal plasma technology with an actively cooled plasma chamber made of high purity quartz, significantly reducing oxygen, hydrogen and nitrogen atomic gas loss through wall recombination. Self-contained and compact, R*evolution delivers up to 10 slm of oxygen radicals from a 6kW power supply with true power accuracy of <1% resulting in a high density, extremely clean radical source for photoresist strip and an optimal clean rate greater than 12 microns/min-1. R*evolution can be used for other surface preparation applications.
Equipped with EtherCAT® communication protocols, R*evolution streams intelligent data sets to the tool or fab database to monitor or modify operating parameters, keeping process tools running at peak efficiency and supporting diagnostics for Automated Process Control (APC) and Fault Detection and Classification (FDC) applications.
Features
- Integrated, self-contained unit designed for on-chamber installation
- High density radical species delivery
- Up to 6 kW of plasma power with accurate power reproducibility
- Advanced degree of power control of <1%
- Fast, reliable plasma ignition in process gas
- Short pulse capable in seconds
Resources
Literature
R*evolution V Remote Plasma Source Datasheet(276 kB, PDF)
Drawings & CADs
R*evolution V Dimensional Drawing(227.2 kB, PDF)
Technical Papers
Toroidal Remote Plasma Sources for Charge-Sensitive On-Wafer Applications(1.5 MB, PDF) High-Throughput Photoresist Strip Using a Toroidal RF Plasma Source in Ashers(369.1 kB, PDF)