RPS-CM12P1 Remote Plasma Source for ALD, CVD and PVD Chambers
Overview
The RPS-CM12P1, 12 kW remote plasma source provides for radical enhanced deposition or selective etch pre-clean processes in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), or Physical Vapor Deposition (PVD) processes. In chamber clean applications, the RPS-CM12P1 has an increased power range and process gas flow capacity to shorten chamber clean times while maintaining the same footprint as the previous generation remote plasma source Paragon® product.
- Compact design enables easy integration to OEM process chambers
- Increased Fluorine radical output shortens clean time cycle
- EtherCAT® communications provides fast, reliable, data streaming and unit control
- A new plasma block assembly results in fast turn maintenance
Products
| Compare | Description | Drawings, CAD & Specs | Availability | Price | |||
|---|---|---|---|---|---|---|---|
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RPS-CM12P1-P12C Remote Plasma Sourse, 12kW, ALD, CVD & PVD Chambers |
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Specifications
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TypeRPS-CM12P1 Remote Plasma Source
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Power Output12 kW, 3 phase 50/60 Hz, 40 Amps RMS max phase
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RF Frequency400 kHz
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Accuracy±1% to power set point
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Gas Supply During IgnitionAr
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NF3 Process Gas1-12 slm, 1-10 T
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NF3 Operation Reactant Output1-12 slm
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Mixed Species Space30-60 slm
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THD>15%
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Inlet Gas ConnectionKF40
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Outlet Gas ConnectionKF50 or KF40
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Control InterfaceAnalog: DB25
Digital: EtherCAT -
Dimensions18.4 x 9.5 x 10.5 in. (46.73 x 24.13 x 26.67cm)
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Weight73 lbs. (33.11 kg)
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ComplianceSEMI F47
Features
Resources
Literature
Drawings & CADs
- RPS-CM12P1 Remote Plasma Source Dimensional Drawing (218.3 kB, PDF)
Ultra-High Velocity