Cleanline® Foreline Plasma Clean System
Overview
The MKS Cleanline® Foreline Plasma Clean System increases tool uptime and productivity by continuously removing process byproducts and deposits from CVD and Etch system pumping lines. This novel approach to foreline cleaning delivers atomic radicals from NF3 or O2 chemistry straight to where process deposits build up, such that they are immediately removed and do not accumulate.
The Cleanline system can be installed anywhere in the vacuum line, including at the chamber outlet, where it can improve particle performance. The internal geometry matches the conductance of standard piping and the plasma source can operate at typical foreline temperatures. This system is designed to be completely passive when not powered.
- Increase tool uptime and productivity
- Improve particle performance
- Improve chamber matching and wafer-to-wafer matching
Products
Configuration Options
Features
Resources
Literature
- Cleanline® Foreline Plasma Clean System (3.1 MB, PDF)
Drawings & CADs
- Cleanline® Foreline Plasma Clean System Dimensional Drawings (964.4 kB, PDF)
Ultra-High Velocity