Our Virtual Wall™ is a patented device that provides a boundary layer to piping in the process system. The boundary layer prevents surface chemical reactions from occurring, which leads to byproducts that can clog a system. The Virtual Wall™ is available in a number of sizes and from a variety of metals and advanced composites. Seals for the Virtual Wall™ include Viton®, Kalrez® and Chemraz®. The Virtual Wall™ is currently being used in a number of semiconductor applications, in a variety of locations in the process including the scrubber inlet, the furnace exit and the pump exit. The Virtual Wall™ is part of the Effluent Management Subsystem™ for LPCVD TEOS. The Virtual Wall™ is installed at the furnace exit, with a combination of a specific nitrogen gas flow, heat and custom spool piece. The Virtual Wall™ is part of the Scrubber Inlet Transition Kit™ for WCVD. The Virtual Wall™ is installed at the scrubber inlet, with a combination of a specific nitrogen gas flow, heat and custom spool piece. The Virtual Wall™ is part of the Scrubber Inlet Transition Kit™ for Aluminum Etch. An advanced composite Virtual Wall™ is installed at the scrubber inlet, with a combination of a specific nitrogen gas flow, heat and custom spool piece. Additionally for Aluminum Etch, we have developed an Effluent Management Subsystem™ to combat byproducts from the turbo pump to the scrubber.